Product Specifications:
- Layers: 4
- Thickness: 0.6-1.6mm
- Material: FR4 KB6160
- Size: 40*80mm
- Surface treatment: ENIG
- Line width/spacing: 5/5mil
- Minimum aperture: 0.25mm
- Solder mask color: Green
- Finished copper thickness: 1/1 OZ
Features:
- The integration of the board design is very high, with a thickness-to-diameter ratio exceeding 10:1, and high difficulty in electroplating of copper.
- Made of TG140 material.
About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:
- Founded in 2009 in Shenzhen, China.
- Expanded process capacity for double-sided and multi-layer boards.
- Exports orders worldwide since 2011.
- New production line in Jiangxi Ji'an for batch orders in 2018.
Company Capabilities:
- Monthly production capacity of 50,000 sqm of PCBs.
- One-stop solutions for clients (PCB & PCBA).
- Over 12 years of experience in PCBs.
- Compliance with RoHS, TS16949, ISO9001, and UL certifications.
- Flexibility in shipment arrangements.
Production Advantages:
- Professional team utilizing automation and digitization for improved efficiency and reduced costs.
- High-quality raw materials with traceable sources.
- Standardized procurement process and strict supplier selection policy.
- High precision processing equipment ensuring quality.
- Intelligent systems for various technical processes.
- Strict inspection with 100% AOI testing and FQA/FQC.
For more information, contact Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
| Our Capabilities and Technology |
| Items |
2022 |
2023 |
| Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
| Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
| Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
| Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
| Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
| Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
| Max. aspect ratio |
10:01 |
12:01 |
| HDI aspect ratio |
0.8:1 |
1:01 |
| Tolerances |
PTH |
±0.076mm |
±0.05mm |
| NPTH |
±0.05mm |
±0.03mm |
| Solder mask opening |
0.05mm |
0.03mm |
| Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
| (other color) 0.1mm |
(other color) 0.08mm |
| Min. core THK. |
0.1mm |
0.08mm |
| Bow&twist |
≤0.5% |
≤0.5% |
| Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
| Impedance Tol. |
±10% |
±8% |
| Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| (Min. BGA size) |
0.2mm |
0.15mm |
| (pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
| (Working panel size) |
600mm*700mm |
600mm*700mm |
| Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |
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