Product Specifications:
Features:
- The board design has high integration with a thickness-to-diameter ratio exceeding 10:1, posing a challenge for copper electroplating.
- Made of TG170 material.
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:
Shenzhen Xinmanda Printed Circuit Board Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With advanced production equipment and technical collaborations, XMD has expanded its capacity for double-sided and multi-layer boards. Since 2011, the company has been serving global markets and in 2018, a new production line was added in Jiangxi Ji'an to handle batch orders.
Key Highlights:
- Monthly production capacity of 50,000 sqm of PCBs
- One-stop solutions for PCB & PCBA needs
- Over 12 years of PCB manufacturing experience
- Quick response time with experienced engineers
- Compliance with RoHS, TS16949, ISO9001, and UL certifications
- Flexible shipment arrangements
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Production Advantages:
- Utilization of automation and digitization for enhanced efficiency and reduced costs
- Usage of high-quality raw materials with traceable sources
- State-of-the-art production equipment for precision and quality
- Implementation of intelligent systems for improved production processes
- Stringent inspection procedures including 100% AOI testing and quality control
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Our Capabilities and Technology |
Items |
2022 |
2023 |
Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
Max. aspect ratio |
10:01 |
12:01 |
HDI aspect ratio |
0.8:1 |
1:01 |
Tolerances |
PTH |
±0.076mm |
±0.05mm |
NPTH |
±0.05mm |
±0.03mm |
Solder mask opening |
0.05mm |
0.03mm |
Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
(other color) 0.1mm |
(other color) 0.08mm |
Min. core THK. |
0.1mm |
0.08mm |
Bow&twist |
≤0.5% |
≤0.5% |
Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
Impedance Tol. |
±10% |
±8% |
Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
(Min. BGA size) |
0.2mm |
0.15mm |
(pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
(Working panel size) |
600mm*700mm |
600mm*700mm |
Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |