Product Specifications:
- Layers: 1
- Thickness: 1.6mm
- Material: FR4 KB6165
- Size: 80*80mm
- Surface treatment: osp
- Line width/spacing: 6/6mil
- Minimum aperture: 0.25mm
- Solder mask color: White
- Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ
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Features:
- The board design boasts high integration with a thickness-to-diameter ratio exceeding 10:1, posing a challenge in copper electroplating.
- Made of TG170 material.
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:
Shenzhen XMD Circuits Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With over 12 years of experience in PCB production, XMD has expanded its process capacity for double-sided and multi-layer boards. The company is capable of producing 50,000 sqm of PCBs monthly and offers one-stop solutions for clients, including PCB and PCBA services. XMD complies with RoHS, TS16949, ISO9001, and UL certifications, ensuring high-quality products.
Production Advantages:
- Utilization of automation and digitization to enhance production efficiency and reduce procurement costs.
- Usage of high-quality raw materials with traceable sources and standardized procurement processes.
- Employment of high precision processing equipment and intelligent systems for efficient operation and quality assurance.
- Strict inspection procedures including 100% AOI testing and FQA/FQC to maintain quality standards.
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Our Capabilities and Technology |
Items |
2022 |
2023 |
Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
Max. aspect ratio |
10:01 |
12:01 |
HDI aspect ratio |
0.8:1 |
1:01 |
Tolerances |
PTH |
±0.076mm |
±0.05mm |
NPTH |
±0.05mm |
±0.03mm |
Solder mask opening |
0.05mm |
0.03mm |
Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
(other color) 0.1mm |
(other color) 0.08mm |
Min. core THK. |
0.1mm |
0.08mm |
Bow&twist |
≤0.5% |
≤0.5% |
Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
Impedance Tol. |
±10% |
±8% |
Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
(Min. BGA size) |
0.2mm |
0.15mm |
(pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
(Working panel size) |
600mm*700mm |
600mm*700mm |
Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |