Product Specifications:
Features:
- The board design has high integration with a thickness-to-diameter ratio exceeding 10:1, posing a challenge for copper electroplating.
- Made of TG170 material.
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:
Shenzhen XMD Circuits Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With over 12 years of experience in PCB manufacturing, XMD has expanded its process capacity for double-sided and multi-layer boards. The company is capable of producing 50,000 sqm of PCBs monthly and offers one-stop solutions for clients, including PCB and PCBA services.
Production Highlights:
- Compliance with RoHS, TS16949, ISO9001, and UL certifications.
- Flexibility in shipment arrangements (FOB HK or Shenzhen by sea or air, CIF via DHL, FedEx, UPS, or ***).
- Utilization of automation and digitization to enhance production efficiency and reduce procurement costs.
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Quality Assurance:
- High-quality raw materials sourced from reputable brands.
- Standardized procurement process and strict supplier selection policy.
- State-of-the-art production equipment ensuring efficient operation and quality output.
- Intelligent systems for auditing, CAM, paneling, and production.
- Stringent inspection procedures, including 100% AOI testing and FQA/FQC checks.
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Our Capabilities and Technology |
Items |
2022 |
2023 |
Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
Max. aspect ratio |
10:01 |
12:01 |
HDI aspect ratio |
0.8:1 |
1:01 |
Tolerances |
PTH |
±0.076mm |
±0.05mm |
NPTH |
±0.05mm |
±0.03mm |
Solder mask opening |
0.05mm |
0.03mm |
Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
(other color) 0.1mm |
(other color) 0.08mm |
Min. core THK. |
0.1mm |
0.08mm |
Bow&twist |
≤0.5% |
≤0.5% |
Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
Impedance Tol. |
±10% |
±8% |
Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
(Min. BGA size) |
0.2mm |
0.15mm |
(pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
(Working panel size) |
600mm*700mm |
600mm*700mm |
Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |