Product Description
Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
Specifications:
- Layers: 1
- Thickness: 1.6mm
- Material: FR4 KB6165
- Size: 80*80mm
- Surface treatment: osp
- Line width/spacing: 6/6mil
- Minimum aperture: 0.25mm
- Solder mask color: White
- Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ
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Features:
- The integration of the board design is very high, with a thickness-to-diameter ratio exceeding 10:1, making electroplating of copper challenging.
- Made of TG170 material.
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Shenzhen Xinmanda Printed Circuit Board Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With advanced production and testing equipment, technical collaborations, and expansion of process capacity, we have been serving clients globally since 2011. Our production facility in Jiangxi Ji'an added a new line in 2018 to cater to batch orders.
Key Highlights:
- Monthly production capacity of 50,000 sqm of PCBs
- One-stop solutions for PCB & PCBA
- Over 12 years of PCB manufacturing experience
- Avg Response time: ≤24 h by experienced Engineers
- Compliance with RoHS, TS16949, ISO9001, and UL certifications
- Flexibility in Shipment Arrangement (FOB HK or Shenzhen by sea or air, CIF via DHL, FedEx, UPS, or ***)
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Our professional team utilizes automation and digitization to enhance PCB production efficiency and reduce procurement costs. We ensure high-quality raw materials, standardized procurement processes, strict supplier selection policies, and employ high precision processing equipment for quality assurance. Our intelligent systems and strict inspection procedures guarantee top-notch PCBs.
| Our Capabilities and Technology |
| Items |
2022 |
2023 |
| Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
| Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
| Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
| Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
| Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
| Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
| Max. aspect ratio |
10:01 |
12:01 |
| HDI aspect ratio |
0.8:1 |
1:01 |
| Tolerances |
PTH |
±0.076mm |
±0.05mm |
| NPTH |
±0.05mm |
±0.03mm |
| Solder mask opening |
0.05mm |
0.03mm |
| Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
| (other color) 0.1mm |
(other color) 0.08mm |
| Min. core THK. |
0.1mm |
0.08mm |
| Bow&twist |
≤0.5% |
≤0.5% |
| Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
| Impedance Tol. |
±10% |
±8% |
| Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| (Min. BGA size) |
0.2mm |
0.15mm |
| (pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
| (Working panel size) |
600mm*700mm |
600mm*700mm |
| Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |
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