Product Specifications:
- Layers: 1
- Thickness: 1.6mm
- Material: FR4 KB6165
- Size: 80*80mm
- Surface treatment: OSP
- Line width/spacing: 6/6mil
- Minimum aperture: 0.25mm
- Solder mask color: White
- Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ
Features:
- The board design has high integration with a thickness-to-diameter ratio exceeding 10:1, posing a challenge for copper electroplating.
- Made of TG170 material.
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:
Shenzhen Xinmanda Printed Circuit Board Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With over 12 years of experience in PCB manufacturing, we offer one-stop solutions for clients, including PCB and PCBA services. Our production capacity allows us to produce 50,000 sqm of PCBs monthly. We comply with RoHS, TS16949, ISO9001, and UL certifications, ensuring high-quality products.
Production Advantages:
- Professional team utilizing automation and digitization to enhance production efficiency and reduce costs.
- High-quality raw materials sourced from reputable brands.
- State-of-the-art production equipment ensuring precision and efficiency.
- Intelligent systems for auditing, CAM, paneling, and production.
- Strict inspection processes including 100% AOI testing and FQA/FQC checks.
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| Our Capabilities and Technology |
| Items |
2022 |
2023 |
| Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
| Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
| Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
| Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
| Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
| Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
| Max. aspect ratio |
10:01 |
12:01 |
| HDI aspect ratio |
0.8:1 |
1:01 |
| Tolerances |
PTH |
±0.076mm |
±0.05mm |
| NPTH |
±0.05mm |
±0.03mm |
| Solder mask opening |
0.05mm |
0.03mm |
| Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
| (other color) 0.1mm |
(other color) 0.08mm |
| Min. core THK. |
0.1mm |
0.08mm |
| Bow&twist |
≤0.5% |
≤0.5% |
| Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
| Impedance Tol. |
±10% |
±8% |
| Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
| (Min. BGA size) |
0.2mm |
0.15mm |
| (pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
| (Working panel size) |
600mm*700mm |
600mm*700mm |
| Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |
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