Product Specifications:
Features:
- The board design has high integration with a thickness-to-diameter ratio exceeding 10:1, making copper electroplating challenging.
- Made of TG170 material.
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:
Shenzhen XMD Circuits Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With over 12 years of experience in PCB production, XMD has expanded its process capacity for double-sided and multi-layer boards. The company offers one-stop solutions for PCB and PCBA needs, with a monthly production capacity of 50,000 sqm. XMD complies with RoHS, TS16949, ISO9001, and UL certifications, ensuring high-quality products.
Production Advantages:
- Professional team utilizing automation and digitization for improved efficiency and reduced costs.
- High-quality raw materials sourced from reputable suppliers.
- State-of-the-art production equipment ensuring precision and quality.
- Intelligent systems for efficient production processes.
- Strict inspection protocols including 100% AOI testing and quality control measures.
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Shenzhen Xinmanda Printed Circuit Board Co., Ltd. offers flexibilities in shipment arrangements, with options for FOB from HK or Shenzhen by sea or air, as well as CIF via DHL, FedEx, UPS, or ***. The company's commitment to excellence and customer satisfaction is reflected in its experienced engineering team, quick response time, and adherence to industry standards.
Our Capabilities and Technology |
Items |
2022 |
2023 |
Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
Max. aspect ratio |
10:01 |
12:01 |
HDI aspect ratio |
0.8:1 |
1:01 |
Tolerances |
PTH |
±0.076mm |
±0.05mm |
NPTH |
±0.05mm |
±0.03mm |
Solder mask opening |
0.05mm |
0.03mm |
Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
(other color) 0.1mm |
(other color) 0.08mm |
Min. core THK. |
0.1mm |
0.08mm |
Bow&twist |
≤0.5% |
≤0.5% |
Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
Impedance Tol. |
±10% |
±8% |
Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
(Min. BGA size) |
0.2mm |
0.15mm |
(pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
(Working panel size) |
600mm*700mm |
600mm*700mm |
Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |