Multilayer PCB Circuit Board for Food Packaging Machines

• Type: Rigid Circuit Board
• Flame Retardant Properties: V0
• Dielectric: FR-4
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: 1PXMDO10689
• Base Material: Aluminum
• Insulation Materials: Epoxy Resin
• Processing Technology: Electrolytic Foil
• Application: Consumer Electronics
• Mechanical Rigid: Rigid
• Material: Fiberglass Epoxy
• Brand: Shengyi, Kb, Nanya, Ilm
• Criteria: Aql II 0.65
• Hole Sizes: 0.15mm/0.2mm
• Bevel Edge: Yes
• Impedance: 50/90/100 Ohm
• Trace Width(Min.): 6mil
• Surfaec Treatment: OSP
• Transport Package: Vacuum Packaging
• Specification: 80*80mm
• Trademark: XMANDA
• Origin: Made in China
• HS Code: 8534001000
• Production Capacity: 50000sqm/Month

Product Description

Product Specifications:

 

• Layers: 1


• Thickness: 1.6mm


• Material: FR4 KB6165


• Size: 80*80mm


• Surface treatment: osp


• Line width/spacing: 6/6mil


• Minimum aperture: 0.25mm


• Solder mask color: White


• Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ

   

  
   

  
  

  

  
   
  

  

  




 
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Product Features:

 

1. The integration of the board design is very high, with a thickness-to-diameter ratio exceeding 10:1, making electroplating of copper challenging.


2. Made of TG170 material.




 
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.:

 

Shenzhen Xinmanda Printed Circuit Board Co., Ltd., formerly known as Jaleny (jlypcb), was established in 2009 in Shenzhen, China. With over 12 years of experience in PCB manufacturing, we offer one-stop solutions for clients, including PCB and PCBA services. Our production capacity allows us to produce 50,000 sqm of PCBs monthly.

 

Key Highlights:

 

• A professional team utilizing automation and digitization to enhance PCB production efficiency and reduce procurement costs.


• High-quality raw materials sourced from reputable brands with a standardized procurement process and strict supplier selection policy.


• State-of-the-art production equipment ensuring high precision and efficient operation to meet various technical processes.


• An intelligent system incorporating features like intelligent audition, CAM, paneling, and production for streamlined operations.


• Stringent inspection procedures including 100% AOI testing, FQA/FQC checks, quality control measures, and a 'Failed One Lost Ten' policy.




 
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We comply with RoHS, TS16949, ISO9001, and UL certifications, offering flexibilities in shipment arrangements to meet our clients' needs.

 

Our Capabilities and Technology
Items		2022	2023
Layers		(MP):22layer,(Sampling):32 layer	(MP):32layer
Max. Board THK		Sampling 4.0mm / MP :3.2mm	Sampling 5.0mm / MP:3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ~ 6OZ	1/3~8 OZ
	Outer layer	1/3 ~ 6 OZ	1/3 ~ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tolerances	PTH	±0.076mm	±0.05mm
	NPTH	±0.05mm	±0.03mm
Solder mask opening		0.05mm	0.03mm
Solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP:±0.1mm	Sampling:±0.075mm /MP:±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
(pitch)(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Special process		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.