Specialized Double-Sided PCB Manufacturer for Electricity Meters

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: 2PXMDL26122
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Shengyi, Kb, Nanya, Ilm, Rogers
• Criteria: Aql II 0.65
• Hole Sizes: 0.25mm
• Bevel Edge: Yes
• Impedance: 50/90/100 Ohm
• Trace Width(Min.): 4mil
• Surfaec Treatment: HASL
• Transport Package: Vacuum Packaging
• Specification: 100*160mm
• Trademark: XMANDA
• Origin: Made in China
• HS Code: 8534009000
• Production Capacity: 50000sqm/Month
• Package Size: 23.00cm * 20.00cm * 18.00cm
• Package Gross Weight: 20.000kg

Product Description

•  
• Layers: 2
• Thickness: 1.6mm
• Material: FR-4 KB6160
• Size: 160*100mm
• Surface treatment: HASL
• Line width/spacing: 0.20/0.20mm
• Minimum aperture: 0.35mm
• Solder mask color: Green
• Finished copper thickness: 1/1 OZ

 

 

 

Our Capabilities and Technology
Items		2022	2023
Layers		(MP):22layer,(Sampling):32 layer	(MP):32layer
Max. Board THK		Sampling 4.0mm / MP :3.2mm	Sampling 5.0mm / MP:3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ~ 6OZ	1/3~8 OZ
	Outer layer	1/3 ~ 6 OZ	1/3 ~ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tolerances	PTH	±0.076mm	±0.05mm
	NPTH	±0.05mm	±0.03mm
Solder mask opening		0.05mm	0.03mm
Solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP:±0.1mm	Sampling:±0.075mm /MP:±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
(pitch)(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Special process		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.